High-Purity Opaque Quartz Shield and Shutter for MOCVD

Understanding the Demand for High-Purity Quartz Components in MOCVD Environments

Metal-Organic Chemical Vapor Deposition (MOCVD) processes rely on a chamber environment that must remain free of particle contamination, outgassing, and thermal degradation across repeated high-temperature cycles. Within this environment, quartz-based components—such as shields, shutters, and related chamber consumables—are subjected to aggressive chemical exposure and thermal stress that standard materials struggle to withstand over long production runs. According to industry pain-point insight shared across the semiconductor high-temperature process sector, "traditional materials like quartz or standard graphite degrade quickly in aggressive chemical or plasma environments, resulting in outgassing, particle shedding, and batch contamination that directly compromises wafer yield and increases operating costs." This is precisely the operational challenge that high-purity quartz consumables are designed to address.

Wuyi Tianyao New Material Technology Co., Ltd., operating under the brand VeTek Semiconductor (also known as Veteksemicon / VETEK), has built its business around solving these exact contamination and durability challenges for semiconductor and photovoltaic manufacturers. Founded in 2016 and headquartered in Wuyi City, Jinhua, Zhejiang Province, China, the company positions itself around providing advanced coating materials, high-purity silicon carbide components, and tailored thermal field systems for multiple semiconductor and photovoltaic application scenarios—capabilities that extend into the company's high-purity quartz and semiconductor glass product line.

Core Quartz Product Line: Purity-Driven Design for Sensitive Chamber Environments

The company's High-Purity Quartz & Semiconductor Glass Products line is positioned around "clean quartz consumables for low-temperature wafer processing, wet etching, and raw material melting." Two representative products from this line illustrate the underlying engineering approach applicable to chamber components such as shields and shutters:

• High Purity Quartz Crucible: Designed for monocrystalline Czochralski (CZ) silicon rod pulling, this component addresses the pain point of standard crucibles releasing bubbles and dissolving under high temperatures, which induces structural defects. Through optimized bubble distribution, the crucible reduces dissolution rates, extending CZ crucible life by over 15% (averaging more than 550 hours for P-type crucibles). It is offered in dimensional options ranging from 14 to 42 inches, with high chemical purity that limits trace metal content and contamination risk.

• ALD Fused Quartz Pedestal: Built as a carrier pedestal for Atomic Layer Deposition (ALD) systems, this product responds to deposition thickness non-uniformity caused by inaccurate flow guides. Its precision flame-welded assembly maintains stable gas flow paths to promote uniform layer deposition, and it is constructed from high-grade fused quartz to minimize contamination while withstanding LPCVD, ALD, and diffusion environments.

These two products demonstrate the same underlying engineering priorities relevant to any opaque quartz shield or shutter intended for MOCVD chambers: dimensional precision, low trace-metal contamination, and thermal resistance under repeated processing cycles.

Complementary Chamber Protection Solutions for MOCVD Systems

Beyond quartz consumables, the company's broader product matrix includes components engineered specifically for MOCVD chamber environments, reflecting a consistent design philosophy of contamination control and thermal durability. The TaC Coated Three-petal Ring, for example, is positioned as a segmented support ring for epitaxial reactors, addressing component cracking and gas leakage caused by high-temperature thermal gradients—the tantalum carbide barrier is noted as "6 times more resistant to high-temperature ammonia than SiC," which is directly relevant to GaN MOCVD corrosion resistance. Similarly, the Tantalum Carbide Coated Cover, built for AIXTRON G10 MOCVD systems, is designed to keep transition element impurities (Fe, Ni, Cu) below 1ppm while offering custom configurations adaptable to multiple wafer sizes—protecting wafer carriers and prolonging preventive maintenance cycles. The Aixtron Satellite Wafer Carrier, a multi-wafer rotating carrier for Aixtron MOCVD systems, further illustrates the company's focus on maintaining uniform gas flow exposure across chambers rated for operations between 1400°C and 1600°C.

Manufacturing Capabilities Behind Precision Quartz and Ceramic Components

The consistency and precision required for chamber components such as shields and shutters stem from the company's vertically integrated manufacturing capabilities, which include prefabrication, hot pressing, purification, machining, and chemical vapor deposition, combined with dimensions capability exceeding 700mm. Machining precision across the platform reaches equipment accuracy of up to 3μm, with maximum processing dimensions of 1200mm × 1500mm. Quality verification is supported by a data and testing infrastructure that includes Glow Discharge Mass Spectrometry (GDMS), Dynamic Secondary Ion Mass Spectrometry (D-SIMS), Scanning Electron Microscopy (SEM), Energy Dispersive Spectroscopy (EDS), X-ray Diffraction (XRD), scratch testers, and coordinate measuring machines (CMM). R&D investment accounts for more than 30% of annual revenue, supported by a dual R&D center platform combining the Liufang R&D Center and the Yongjiang Laboratory Thermal Field Materials Innovation Center.

Proven Performance in Real-World Deployments

The company's approach to contamination control and dimensional precision has been validated in documented customer scenarios. In work with GlobalWafers / Soitec, prominent international silicon wafer manufacturers based in Taiwan and France, the company deployed CVD SiC coated susceptors and carrier rings compatible with LPE and ASM tools for high-uniformity silicon epitaxy (Si Epi) processing. This engagement reached wafer thickness uniformity control tolerances within 10μm, while the company delivered over 15,000 thermal field components annually across global operations. In a separate case with the Rohm Group Company (SiCrystal), a global producer of silicon carbide substrates based in Germany/Japan, CVD TaC coated graphite components and pyrolytic carbon coatings extended graphite crucible reuse cycles to 200 hours, achieved zero weight loss in high-temperature environments, and reduced crystal defect densities such as micropipes and etch pits.

Quality Assurance Framework

The company's quartz and ceramic product lines operate under a certified quality framework, including ISO 9001:2015 Quality Management System certification, ISO 14001:2015 Environmental Management System certification, and ISO 45001:2018 Occupational Health and Safety Management System certification. Products are also verified as RoHS Compliant, REACH SVHC Screening Compliant, and Halogen-Free Certified through SGS testing, alongside CNAS management system certification.

Customer Feedback and Delivery Assurance

Client testimonials reflect consistent satisfaction with the company's process and communication standards. One customer noted, "The supplier offers high quality at a reasonable price, making them a valued business partner," while another observed, "Every step of the process was smooth. A reliable manufacturer indeed." A further comment highlighted responsiveness: "Their attention to detail and commitment to quality is excellent; we received satisfactory goods in a short term."

For custom quartz and thermal field components, the company provides trial samples within 30 days, with custom precision items requiring CNC machining and CVD coating delivered within 3 to 6 weeks, and bulk production orders completed within 45 days. Each order can be accompanied by Certificates of Analysis (COA), Certificates of Conformance (COC), and Certificates of Origin (COO), supported by 24/7 remote technical consulting for thermal field optimization—an approach designed to give MOCVD equipment operators consistent, well-documented quartz and ceramic component performance across production cycles.

https://www.veteksemicon.com/
Wuyi Tianyao New Material Technology Co., LTD